1) Cut copperclad substrate with the shear.
2) Stack the substrates (entry foil / top laminate / inner laminate /
   bottom laminate / exit foil / backing material). Backing material
   not needed for laser drilling.
3) Drill two tapered dowel holes; insert tapered dowel pins.
4) CNC Drilling (convert Gerber file to GCODE format).
5) Holewall activation (use squeegee).
6) Holewall extraction (use vacuum).
7) Bake 30min @ 100°C.
8) Inspect holewalls.
9) Lap surface flat, clean with abrasive and copper brightener.
10) Clean with acetone and air.
11) Bake 5min @ 100°C.
12) Quick dip in 10% H2SO4 solution.
13) Electroplate at least 0.001" copper.
14) Move to clean room and clean/dry board.
15) Laminate the photopolymer onto the substrate.
16) Print the two negatives.
17) UV exposure.
18) Remove protective mylar sheet from photopolymer.
19) Dip in developer solution 2 min per side at 38°C (±6degC).
20) Rinse with warm water spray.
21) Clean with soft sponge.
22) Inspect at 10x magnification. Goto step 19 if needed.
23) Air dry.
24) Bake 5min @ 100°C and let cool to room temperature.
25) Preheat etchant to 49°C.
26) Standard cleaning procedure.
27) Etch.
28) Rinse with deionised water.
29) Rinse with tap water.
30) Dip in 5% sodium hydroxide solution @ 50°C for >2min.
31) Rinse and dry.
32) If needed, electroplate gold onto edge connectors.
33) Silk screening.
34) Bare-board test.