1) Cut copperclad substrate with the shear. 2) Stack the substrates (entry foil / top laminate / inner laminate / bottom laminate / exit foil / backing material). Backing material not needed for laser drilling. 3) Drill two tapered dowel holes; insert tapered dowel pins. 4) CNC Drilling (convert Gerber file to GCODE format). 5) Holewall activation (use squeegee). 6) Holewall extraction (use vacuum). 7) Bake 30min @ 100°C. 8) Inspect holewalls. 9) Lap surface flat, clean with abrasive and copper brightener. 10) Clean with acetone and air. 11) Bake 5min @ 100°C. 12) Quick dip in 10% H2SO4 solution. 13) Electroplate at least 0.001" copper. 14) Move to clean room and clean/dry board. 15) Laminate the photopolymer onto the substrate. 16) Print the two negatives. 17) UV exposure. 18) Remove protective mylar sheet from photopolymer. 19) Dip in developer solution 2 min per side at 38°C (±6degC). 20) Rinse with warm water spray. 21) Clean with soft sponge. 22) Inspect at 10x magnification. Goto step 19 if needed. 23) Air dry. 24) Bake 5min @ 100°C and let cool to room temperature. 25) Preheat etchant to 49°C. 26) Standard cleaning procedure. 27) Etch. 28) Rinse with deionised water. 29) Rinse with tap water. 30) Dip in 5% sodium hydroxide solution @ 50°C for >2min. 31) Rinse and dry. 32) If needed, electroplate gold onto edge connectors. 33) Silk screening. 34) Bare-board test.